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MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets StdPbc-0316 org in March 2012

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Description

org in March 2012

SEMI F63-0521 (technical revision)

This Specification applies to high-purity gas piping systems and components used in semiconductor manufacturing facilities and comparable research and development areas

SEMI PV22 — Specification for Silicon Wafers for Use as Photovoltaic Solar Cells

This Standard describes procedures for the measurement of flexible thin film PV module and severity of test requirements

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets StdPbc-0316 org in March 20121 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide

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