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P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Revision:SEMI P3-0298 - Superseded レジストのサプライヤとユーザとの間の打ち合わせにおいて,数量的な値については,パラメータ毎になされるべきである。

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Description

レジストのサプライヤとユーザとの間の打ち合わせにおいて,数量的な値については,パラメータ毎になされるべきである。

This Test Method covers selection of the point at which the ROA is determined and the reference line to be utilized for this determination

This edition was approved for publication by the global Audits and Reviews Subcommittee on April 15

SEMINAR INFO:

This Test Method can be used to analyze the oxygen content in PV silicon materials for photovoltaic applications

P00300 - SEMI P3 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates Revision:SEMI P3-0298 - Superseded レジストのサプライヤとユーザとの間の打ち合わせにおいて,数量的な値については,パラメータ毎になされるべきである。NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. NOTICE: This Document was completely rewritten in 2008. This Specification covers the general requirements on the photoresist and e beam resist coating for hard surface photoplates. See SEMI P1 and SEMI P2 for requirements

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