Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 you can standardize the operating

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Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 you can standardize the operating1 Scope This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine pitch Ball Grid Array (FBGA), and Fine pitch Land Grid Array (FLGA).