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This specification is specific to Hydrogen (H2)
SEMI C90-00-1015 (first published)
the Current version is the official and authoritative version
This Document applies to the shelf life of properly packaged
SEMI C92-0216 (replaced by SEMI F119)
3D01800 - SEMI 3D18 - Guide for Wafer Edge Trimming for 3DS-IC Process StdPbc-0924 This specification is specific to3DS IC wafer edge trimming process is a key step for successful wafer thinning after the wafer bonded in the 3DS IC process. This Guide provides a feasible approach to perform the wafer edge trimming. This Document provides guidance for specifying edge trimming and resultant particle count to ensure the successful wafer thinning process after the wafer edge trimming. This Document covers guidance for specifying wafer edge trimming and resultant
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