T01800 - SEMI T18 - Specification of Parts and Components Traceability Revision:SEMI T18-1106 - Superseded SEMI MF723-0307E (Reapproved 0412)

SEMI MF723-0307E (Reapproved 0412)

Bookings data collection began in 1997 and ended in 2016

polymeric encapsulation foils and glass sheets can be tested for their PID-s sensitivity

This Standard is designed to be updated as EQIPs are identified for new and/or existing equipment process types in this Standard

This Guide can also assist producers and users of TSV metrology to develop products and conduct meaningful evaluations

T01800 - SEMI T18 - Specification of Parts and Components Traceability Revision:SEMI T18-1106 - Superseded SEMI MF723-0307E (Reapproved 0412)The purpose of this Document is to provide standard means to collect and manage data to estimate lifetime or remaining time before such maintenance as calibration, cleaning and replacement more accurately. The final goal of the Standard is to realize the traceability of semiconductor, flat panel display (FPD), or MEMS devices with tracing parts and or components of their manufacturing equipment, including jigs and some consumable materials. This