G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Revision:SEMI G42-0996 (Reapproved 1104) - Superseded SEMI C28-0611 (technical revision)

SEMI C28-0611 (technical revision)

10-0600 (Reapproved 0124)

Recommendations for the 130 to 11 nm generations are unchanged from previous versions of this Guide

Furthermore

一般に，人間の検査者に代わる計測器実装の困難さは，出所および場所に伴う人的要因の変動にある。

G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Revision:SEMI G42-0996 (Reapproved 1104) - Superseded SEMI C28-0611 (technical revision)This Document provides the requirements for a standard thermal resistance test board to be used in junction to ambient thermal resistance measurement of a semiconductor package under still and forced air condition as a referee method. This Document describes the thermal resistance test board for measurement of the following packages: Dual In Line Packages (DIP), Plastic Chip Carrier Package (PCC), Quad Flat Package (QFP), Pin Grid Array Package (PGA),