M06700 - SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics Revision:SEMI M67-1108 - Superseded This Test Method applies to

This Test Method applies to gas source equipment used in semiconductor manufacturing facilities and comparable research and development areas

The report also highlights packaging technology offerings by manufacturing location

SEMI E154 — Specification for Mechanical Features of 450 mm Load Port

on one hand

The pellicle exclusion volume of this Specification accommodates pellicles which extend the full length of the reticle and up to a maximum pellicle width of 124 mm

M06700 - SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics Revision:SEMI M67-1108 - Superseded This Test Method applies toWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable for quantifying the flatness aspects of near edge geometry of wafers used in semiconductor device processing. The ESFQR, ESFQD or ESBIR metric may be