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Ships within 48 hours · Estimated delivery Aug 5 - Aug 10
2020 manufacturer MICROSEMI asin B0137IOLCO
Engineered with advanced materials and tested for stringent quality assurance
HP Part Number: 5541890-A (alt: S5D-J300SS
5" backplane to the system board
Its robust design supports continuous workloads
HPE C3000 & C7000 Interconnect Filler Module | 414053-001 MBA3300RC 2020 manufacturer MICROSEMI asin B0137IOLCOQuick Specs Type: Interconnect bay filler blank Enclosure Compatibility: HPE BladeSystem C3000 and C7000 Purpose: Maintains airflow and thermal balance Installation: Tool less, snap in design Use Case: Blocks empty interconnect bays when no module is present Material: Durable plastic construction Part Number: 414053 001 The HPE C3000 & C7000 Interconnect Filler Module is a precision designed blank used to fill empty interconnect bays in BladeSystem